128 cores, 16 channels of DDR5!Next Generation Super Powerful Domestic ARM Server CPU Exposure

On December 29, the 2020 Feiteng Ecological Partner Conference was held in Tianjin. At this conference, Feiteng not only officially released the new desktop consumer processor Tengrui D2000 series, but also announced the next generation of data center processors.

  128 cores, 16 channels of DDR5!Next Generation Super Powerful Domestic ARM Server CPU Exposure

According to the previous roadmap, the next-generation model is Tengyun S5000, 7nm process, supports PSPA 1.0 security architecture, and will be released in the third quarter of 2021; the next generation is Tengyun S6000, 5nm process, with double the overall performance and supports PSPA 2.0 security Architecture, Q4 2022 release.

  128 cores, 16 channels of DDR5!Next Generation Super Powerful Domestic ARM Server CPU Exposure

According to the latest introduction, Feiteng’s next-generation CPU for data centers will use the new FTC860 core, which is based on the ARMv8.2+ instruction set architecture and can provide up to 128 cores, but it will be changed to support 2-4 parallel channels, and the single system core is still the most 512 cores.

The new architecture will integrate private L2 cache, up to 64MB L3 cache, memory support upgrade to DDR5, and expand to 16 channels, support memory check and error correction, as well as up to 64 lanes of PCIe 5.0, and support PSPA 1.0 architecture in terms of security.

In terms of performance, the single-core performance can be improved by 50%, the SpecCPU2006 score exceeds 25 points, the computing performance is more than doubled, the SpecCPU2006 score exceeds 1000 points, the memory performance is improved by more than 60%, and the I/O performance is improved by up to 15 times.

  128 cores, 16 channels of DDR5!Next Generation Super Powerful Domestic ARM Server CPU Exposure

For the future, Feiteng will introduce a new flexible architecture concept, including large and small core designs that take into account performance and power consumption, highly integrated SoCs covering most common interfaces, and differentiated configurations that adapt to multi-scenario applications.

In terms of embedded, Feiteng has planned a new Tenglong E series. It plans to launch the Tenglong E2000 series in the second quarter of 2021, with a 14nm process, supporting PSPA 1.0, and in the third quarter of 2022, it will release the Tenglong E3000 series, 14nm, with rich integration of I. /O interface, supports PSPA 2.0.

According to the information announced at this conference, the Tenglong series will provide three different specifications: the highest-end quad-core, including two FTC663 and two FTC310 cores, with a main frequency of 1.5-2.0GHz and a typical power consumption of 6W.

The mainstream is dual-core, two FTC-310 cores, clocked at 1.5GHz, and typical power consumption is 3W.

The lowest is a single core, an FTC-310 core, clocked at 1.0GHz, and typically consumes 1.5W.

Tenglong series can meet the needs of various embedded scenarios, such as power generation, power transmission, rail transit, PLC, cloud terminal, industrial control, etc.


At the same time, Feiteng is also conducting various forward-looking research and investment for the future development of processors. One is heterogeneous processors that integrate CPU, GPU, DSP, FPGA, I/O, AIPU (Artificial Intelligence Processing Unit), memory , communication and other different modules, through more flexible architecture design, can further optimize yield and cost, and provide more abundant product forms and business models.

The second is silicon-based optical communication and optical computing, including multi-channel optical communication, on-chip optical communication networks, silicon-optical AI accelerators, photonic devices/circuits and chips.

The third is quantum computing, including Electronic CMOS compatible devices, tunnel electron/spin/ferroelectric/low temperature superconducting devices, chip-level implementation/process and system methodology, and interoperability and collaboration with traditional computing platforms.


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