NXP unveils Bluetooth 5 SoC with integrated NFC functionality

NXP Semiconductors has announced the QN9090 and QN9030 Bluetooth 5 SoCs that support 802.15.4, multi-protocol RF and NFC. The latest addition to the QN family of Bluetooth Low Energy (BLE) devices enables the next generation of smart connected devices with lower power consumption, a high-performance CPU with a wide operating temperature range, a mix of analog and digital peripherals, and BLE Mesh support.

The QN9090 and QN9030 devices feature a built-in 48MHz Arm Cortex-M4 and include up to 640KB of onboard flash and 152KB of SRAM, providing storage space and flexibility for complex applications and secure over-the-air (OTA) updates. The QN family of devices helps developers develop feature-rich products as beacons and mesh networks to develop various IoT applications such as personal healthcare devices, sports and fitness trackers, connected devices, building and home automation , toy and gaming peripherals, and accelerate development and time-to-market.

As NXP’s on-chip NFC-integrated BLE SoCs, variants of the QN9090T and QN9030T support out-of-band wireless communication to support different use cases. By connecting a QN9090T-based IoT device to a smartphone, tablet, or other NFC reader device, a BLE connection can be established quickly, simplifying the pairing process. The built-in NFC NTAG eliminates the need for powering the tag and supports diagnostics or device debugging at various stages of the device’s entire lifecycle.

Product features include:

Low Power: Ultra low power solution ideal for Bluetooth, battery powered applications with 4.3mA Rx current and 7.3mA Tx current @ +0dBm.

? CPU with scalable embedded flash and SRAM: 48 MHz ARM Cortext-M4, 640KB embedded flash and 152KB SRAM.

• Advanced integration with powerful peripherals including NFC NTAG: Reduce system board size and lower manufacturing costs through digital and analog integration.

Microprocessor Intelligence: Rich MCU feature set, including various low-power modes, digital MIC interface with wake-on-audio event, and Quad SPI NOR flash controller for high-density data or code storage.

?Standardized Connections: 2.4GHz Bluetooth Low Energy 5.0 transceiver with 2Mbps support and up to 8 concurrent Bluetooth connections, and support for antenna diversity.

? Integrated power amplifier with high transmit power (up to +11 dBm), enabling long distance transmission.

? Wide temperature range: -40 ℃ to +125 ℃, suitable for various environments.

• Broad Product Portfolio: NXP offers pin-to-pin compatible solutions for 802.15.4 and Multiprotocol RF devices, as well as leading solutions across the embedded processing spectrum.

The NXP MCUXpresso SDK for QN is compatible with the latest toolchains in IAR and NXP’s MCUXpresso IDE. The complete MCUXpresso software and tool suite provides a seamless software experience between NXP devices and provides a quick and easy way to add Bluetooth LE functionality to existing designs on other NXP devices. The NXP IoT Toolbox smart device application and NXP connectivity tools and test tools are available to help developers evaluate RF performance and conduct effective testing.

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